Thermo-Silicone Foil (1.9 W/mK)

Application area Power semiconductors and power modules in power supply units, electric... more

Application area

Power semiconductors and power modules in power supply units, electric drives, telecommunications modules, motor control units, frequency converters, UPS (uninterrupted power supply)

Product specification

Extremely high thermal conductivity

Very low total thermal transfer resistance

Fibreglass reinforced for mechanical stability

Very flexible

Quick and clean handling, superior process reliability

No thermal paste required

Technical specification

Material: silicone, fibreglass reinforced

Colour: salmon or grey

Temperature range: -60 to +200 °C

Filler: thermally conductive ceramic

Tensile strength: see table

Tear resistance: see table

Hardness (Asker C): 90

Dielectric constant: 3.8 - 4.3 at 1 kHz

Volume resistivity: 1.8 x 10¹² to 1.0 x 10¹² Ohm x m

Thermal conductivity: 1.9 W/mK

Heat transfer resistance: see table

Flammability rating: UL 94 V-0

General Information High-tech materials for heat problems in high-tech devices offer,... more

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General Information

High-tech materials for heat problems in high-tech devices offer, compared to traditional use of mica with heat-conductive paste, the following important advantages:

Specified layer thicknesses

Quick and clean handling, superior process reliability

Interchangeability of materials without surface treatment

Safe reproducibility of results

Please note also the silicone-free heat technology products such as waxed PI sheets and carbon foils or heat-conductive paste.

Item	Thickness mm	Zugf. MPa	Wrf. kN/m	Wärme-ÜW¹	Abmessung mm	Einheit Stück	Price Euro*
339567	0,2	25,9	70	0,3	320 x 1000	1	200.00
339568	0,2	25,9	70	0,3	320 x 250	1	95.00
339569	0,3	24,1	69	0,45	320 x 1000	1	225.00
339570	0,3	24,1	69	0,45	320 x 250	1	103.00
339571	0,45	20,4	68	0,65	320 x 1000	1	354.00
339572	0,45	20,4	68	0,65	320 x 250	1	150.00
339573	0,8	9,3	24	1,05	320 x 1000	1	585.00
339574	0,8	9,3	24	1,05	320 x 250	1	238.00