High-Tech Electrical Conductivity Adhesive - one-component | Reichelt Chemietechnik

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High-Tech Electrical Conductivity Adhesive - one-component

Application area Solderless electrically conducting connections at sensitive, especially... more

Application area

Solderless electrically conducting connections at sensitive, especially thermically sensitive components

Solderless electrically conductive connections at difficult accessible locations

Solderless electrical connections at mechanically sensitive contact points

Contacting of components and subassemblies, also for higher voltages

Manufacturing of electrical conductor tracks on plastics, ceramic, glass etc.

Repair of interrupted electrical connections

Product specification

Heat-curing, ready-to-use, epoxy resin-based one-component adhesive, solvent-free, thermically highly loadable and of high heat dissipation capacity. With electrically conductive silver filler. Dilutable with toluene, xylene or butylcellusolve.

Technical specification

Electrically conductive filler: purest silver

Consistency: soft paste

Density: 3.3 g/cm³

Curing time:

at +95° C: 4 hours

at +105 °C: 2 hours

at +120 °C: 1 hour

at +135 °C: 30 minutes

at +160 °C: 10 minutes

Moisture absorption: 0.5 %

Tensile shear strength: 25 N/mm²

Shore hardness D: 82°

Temperature resistance: -60 to +175 °C

Coefficient of thermal expansion: 8.7 x 10-5/K

Thermal conductivity: 1.7 W/m * K

Volume resistivity: 10^-2 Ohm cm²

Shelf life: 12 months in original package, at +5 to +10 °C

No additional information available.

Item	Image	Volume g	Einheit Stück	Price Euro*	Buy
45405		50	1	583.00

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